termičke projektne tačke prekidača napajanja

    Heat dissipation is an important condition to ensure the safe and reliable operation of switching power adapter. If the temperature is too high, the performance index of the power supply will change, and even the failure of the power adapter will be caused. Therefore, the fundamental task of heat dissipation design is to control the temperature rise so that it does not exceed the specified limit of reliability.

   The components of the switching power adapter have certain requirements for the working temperature range. If the temperature exceeds its limit, it will cause the change of the working state of the power supply, so that the electronic equipment can not work stably and reliably, shorten its service life, and even cause the damage of the electronic equipment.

      Therefore, we should pay more attention to the thermal design of the power supply prekidač, u nastavku su neke dizajnerske tačke za referencu prilikom projektovanja termičkog rješenja za uređaje:

1. Izbor hladnjaka. Princip izbora rashladnog elementa je odabir hladnjaka male zapremine i male težine što je više moguće uz pretpostavku da se osigura dovoljno rasipanje topline, kako bi se uštedio unutrašnji prostor i smanjila ukupna težina adaptera za napajanje.

2. Installation of heatsink. When installing the heatink, the installation method with small heat dissipation and thermal resistance shall be selected as far as possible.

3. Minimizirajte termičku otpornost interfejsa. Površina hladnjaka mora biti ravna i glatka, nanesena silikonskom mašću ili zaptivkom koja provodi toplinu kako bi se smanjio toplinski otpor kontakta između radijatora i energetskog poluvodiča.

4. Heatsink surface treatment . In order to increase the radiation capacity of the heatsink, the surface of the heatsink can be coated with a layer of high radiation coefficient coating such as black paint or oxide. The radiator with black coating shall be preferred and the coating shall be protected from damage.

5. Installation position of power semiconductor. The power semiconductor shall be installed in the center of the heatsink, so that the heatsink can be heated evenly and improve the heat dissipation efficiency.

6. Position of heatsink. The heatsink shall be in direct contact with the air flow outside the power supply as far as possible to reduce the ambient temperature. At the same time, the effect of convective heat transfer of radiator can be improved.